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Design And Analysis Of Heat Sinks Pdf

design and analysis of heat sinks pdf

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In this study, an optimal design method for minimizing the size of plate fin heat sinks subject to natural convection is proposed. An analytic model for predicting the thermal resistance of a fin array, as well as the heat sink substrate, is developed. In order to validate the analytic results, we performed numerical study and experimental studies. Based on the validated analytic results, we suggest an algorithm for minimizing the size of a natural convective plate fin heat sink subject to a constant thermal resistance. As the substrates thickness increases, the substrates conduction thermal resistance decreases while the convection thermal resistance decreases as the fin height increases.

Design and analysis of heat sinks

In this article, we will learn about Heat Sink and different aspects of Heat Sinks like what is a heat sink, what are the types of heat sinks, what is active cooling and passive cooling etc. A straight fin heat sink is cut at regular intervals. As the amount of power dissipation in the device increases, the size of the heat sink must increase to allow more surface area to be exposed to the ambient. Next, the equivalent circuit of an IGBT 2-pack-module and a diode bridge mounted on a heat sink is shown in Fig. Typically, airflow is either classified as natural or forced convection. The middle design is very close to the optimal design in that the fluid leaves the heat sink just as it becomes fully hot. A farmhouse style sink, also known as an apron sink, extends over the edge of your counter.

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A heat sink also commonly spelled heatsink [1] is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes LEDs , where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device.

Optimal design method for plate fin heat sinks subject to natural convection

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design and analysis of heat sinks pdf

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A heat sink also commonly spelled heatsink [1] is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes LEDs , where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink.

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  1. Kari M.

    02.12.2020 at 00:49
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